论文及著作
1. H.T.Chen*, T.Q. Hu, M.Y. Li, Z.Q. Zhao, Cu@Sn Core – Shell StructurePowder Preform for Hightemperature Applications Based on Transient Liquid Phase Bonding, IEEE Transactions on Power Electronics, 32(2017)441.(IF:7.151)
2. J.D. Liu#,H.T.Chen#, H.J. Ji, M.Y. Li, Highly conductive Cu-Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticles, ACS Applied Materials&Interfaces, 8(2017)33289，#: Contributed equally. （IF:7.504）
3. F.W. Yu, C.J. Hang, M.H. Zhao, H.T. Chen, An interconnection method based on Sn-coated Ni core-shell Powder Preforms for High-Temperature Applications, Journal of Alloys and Compounds, 776(2019)791.
4. C.J. Hang, J.J. He, Z.H. Zhang, H.T. Chen*, M.Y. Li, Low temperature bonding by infiltrating porous Ag with Sn3.5Ag solder paste for die attachment in power device packaging,Sicentific Reports, 8(2018)17422
5.F.W. Yu, H.T. Chen*, C.J. Hang, M.Y. Li, Fabrication of high-temperature resistant bondline based on multilayer core–shell hybrid microspheres for power devices, Journal of Materials Science: Materials in Electronics, 2019,In press.
6.Bo Hu , Fan Yang , Ye Peng , Chunjin Hang*, Hongtao Chen , Changwoo Lee , Shihua Yang , Mingyu Li *, Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high temperature applications, Journal of Materials Science: Materials in Electronics, In press.
7. Xingchi XIE,Chunjin Hang,Jianqiang Wang,Yue Su,Jie Ma,Qiang Guo,Hongtao Chen*, Mingyu Li, A low temperature die attach technique for high temperature applications based on Indium infiltrating micro-porous Ag sheet, Journal of Materials Science: Materials in Electronics, 29 (2018) 18302.
8. Dong Wang, Jianhua Zhu,Shangheng Wang, Hongtao Chen,Xingjun Liu, Cuiping Wang, Experimental Investigation and Thermodynamic Calculation of Phase Equilibria in the Mg-Pb-Sn Ternary System, J. Phase Equilib. Diffus. 39 (2018)324
9. Jiahui Gu, Xuelin Wang, Hongtao Chen*, Shihua Yang,Huanhuan Feng, Xing Ma, Hongjun Ji, Jun Wei and Mingyu Li*, Conductivity enhancement of silver nanowire networks via simple electrolyte solution treatment and solvent washing, nanotechnology,29 (2018) 265703.
10. T.Q. Hu, H.T. Chen*, M.Y. Li, C.Q. Wang, Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions Materials and Design, 131(2017)196. （IF:4.364）
11. T.Q. Hu，H.T. Chen*, C.Q. Wang, M.S. Huang, F.F. Zhao, Study of electroless Sn-coated Cu microparticles and their application as a high temperature thermal interface material, Surface&coatings technology, 319(2017)230（IF:2.589）
12. F.W. Yu, Q. Guo, B. Wang, X. Ma, M.Y. Li, H.T. Chen*, Ag@Sn Core-shell Powder Preform with a High Re-melting Temperature for High-temperature Power Devices Packaging, Advanced Engineering Materials，2017，DOI:10.1002/adem.201700524. （IF:2.319）
13. Qiang Guo, Fuwen Yu, Hongtao Chen*, Mingyu Li, Microstructure Evolution during Reflow and Thermal Aging in a Ag@Sn TLP Bondline for High-temperature Power Devices, Journal of materials Science: materials in electronics, 2017， DOI: 10.1007/s10854-017-8232-4.（IF:2.019）
14. Q.Guo, S. Sun, Z.H. Zhang, H.T. Chen*, M.Y. Li, Microstructure Evolution and Mechanical Strength Evaluation in Ag/Sn/Cu TLP Bonding Interconnection during Aging Test,Microelectronics Reliability,2017, DOI:10.1016/j.microrel.2017.12.001. (IF:1.371)
15. S.Y. Sun,Q. Guo,H.T. Chen*, M.Y. Li*, C.Q. Wang, Solderless Bonding with Nanoporous Copper as Interlayer for Hightemperature Applications, Microelectronics Reliability, DOI: 1016/j.microrel.2017.12.012(IF:1.371)
16. Z.H. Zhang, H.J. Cao, H.T. Chen, Formation mechanism of a cathodic serrated interface and voids under high current density, Materials letter, 211(2018)191.（IF:2.572）
17. Y.F. Yang, H.T.Chen*, M.Y. Li, Dissimilar copper-aluminum joint processed by low-temperature nickel electroplating, Journal of Materials Processing Technology, 242(2017)68.（IF:3.147）
18.T.Q. Hu, H.T.Chen*, M.Y. Li, Die Attach Materials with High Remelting Temperatures Created by Bonding Cu@Sn Microparticles at Lower Temperatures, Materials and Design, 108(2016)383. (IF:4.364)
19. C.L. Mai, J.Y. Sun, H.T.Chen*, C.K. Mai, M.Y. Li, Silicon direct bonding via low-temperature wet chemical surface activation, RSC Advances, 6(2016)37079.
20. H.T. Chen, C.J. Hang, X. Fu, M.Y. Li, Microstructure and Grain Orientation Evolution in Sn3.0Ag0.5Cu Solder Interconnects under Electrical Current Stressing, Journal of Electronic Materials, 44(2015)3880.
21. M. Yang, H. Chen, X. Ma, M. Li, Y. Cao, J. Kim, Solid-state interfacial reaction of eutectic Sn3. 5Ag and pure tin solders with polycrystalline Cu substrate, Journal of Materials Science, 49(2014)3652.
22. H.T. Chen, B.B. Yan, M. Yang, X. Ma, M.Y. Li, Effect of grain orientation on mechanical properties and thermomechanical response of Sn-based solder interconnects, Materials Characterization,Vol.85(2013)64.
23. M. Yang, Y. Cao, S.M. Joo, H.T. Chen, X. Ma, M.Y. Li, Cu6Sn5 Precipitation during Sn-based solders/Cu joints solidification and its effects on the growth of interfacial intermetallic compounds, Journal of Alloys and Compounds, Vol.582(2014)688.
24. L. Wang, C. Wan, Y.G Fu, H.T. Chen, X.J. Liu, M.Y. Li. Study on the effects of adipic acid on properties of dicyandiamide-cured electrically conductive adhesives and the interaction mechanism. Journal of Electronic Materials，43(2014)132.
25. L. Wang, C. Wan, H.Q. Wang, H.T. Chen, X.M. Zhu, M.Y. Li, Electrical property improvement of dicyandiamide-cured electrically conductive adhesives through in-situ replacement by difunctional acids and the impact on storage, International Journal of Adhesion&Adehsives, Vol.45(2013)132.
26. J. Han, H.T. Chen, M.Y. Li, Shear deformation behaviors of Sn3.5Ag lead-free solder samples, Journal of Materials Science and Technology, Vol.29 (2013)471.
27. 许家誉，陈宏涛*，李明雨，基于晶体取向的无铅互连焊点可靠性研究，金属学报，Vol.48(2012)1042.
28. H.T. Chen, J. Li, M.Y. Li, Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress, Journal of Alloys and Compounds, Vol.540(2012)32.
29. H.T. Chen, J. Han, J. Li, M.Y. Li, Inhomogeneous Deformation and Microstructure Evolution of Lead-free Solder Interconnects during Thermal Cycling and Shear Testing, Microelectronics Reliability, Vol. 52(2012)1112.
30. H.T. Chen, L. Wang, J. Han, M.Y. Li, H. Liu, Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress, Microelectronic Engineering, Vol.96 (2012) 82.
31. J. Han, H.T. Chen, M.Y. Li, The role of crystal orientation in the failure of Sn3.0Ag0.5Cu solder joints under thermomechanical fatigue, Acta Metallurgica Sinica (English Letters), Acta Metall. Sin.(Engl. Lett.), Vol.25(2012)214.
32. J. Li, M. Turunen, S. Niiranen, H. Chen, M. Paulasto-krockel, A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive, Microelectronics Reliability, 52(2012)2962.
33. H.T. Chen, M. Mueller, T.T. Mattila, J. Li, X.W. Liu, K.-J. Wolter, M.
Paulasto, Localized Recrystallization and Cracking of Lead-Free Solder Interconnections under Thermal Cycling, J. Mater. Res., Vol. 26 (2011) 2103.
34. H.T. Chen, L. Wang, J. Han, M.Y. Li, Q.B. Wu, Grain orientation evolution and deformation behaviors in Pb-free solder interconnects under mechanical stresses, Journal of Electronic Materials, Vol.40 (2011) 2445.
35. H.T. Chen, J. Han, M.Y. Li, Localized recrystallization induced by subgrain rotation in Sn3.0Ag0.5Cu ball grid array solder interconnects during thermal cycling, Journal of Electronic Materials, Vol.40 (2011) 2470.
36. J. Li, H. Xu, J. Hokka, T. T. Mattila, H.T. Chen, M. Paulasto-Kröckel, Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests, Soldering and Surface Mount Technology. vol.23(3),(2011) 161-167.
37. H.B. Xu, M.Y. Li, H.T. Chen, Y.G. Fu, and L. Wang, Lead-free bumping using an alternating electromagnetic field, Journal of Electronic Materials, Vol. 36, No. 1, (2009) 33-39.
38. H. Chang, H.T. Chen, M.Y. Li, L. Wang, Y.G. Fu, Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water, Journal of Electronic Materials, vol.38, No. 10, (2009) 2170-2178.
39. H.T. Chen*, C.Q. Wang, Cheng.Y, and Y. Huang, Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints, Journal of Electronic Materials, Vol. 36, No. 1, (2007) 26-32.
40. H.T. Chen*, C.Q. Wang, Cheng.Y, M.Y. Li, and Y. Huang, Cross-interaction of interfacial reactions in Ni (AuNiCu)-SnAg-Cu solder joints during reflow soldering and thermal aging, Journal of Electronic Materials, Vol. 36, No. 1, (2007) 33-39.
41. H.T. Chen*, C.Q. Wang, M.Y. Li, and D.W. Tian, Effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu and SnPb solders with Au/Ni/Cu substrate during aging, Materials Letters, 60 (2006) 1669–1672.
42. H.T. Chen*, C.Q. Wang, M.Y. Li, Y.H. Tian, Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability, Journal of Materials Science and Technology, Vol.21 No. 3 (2005) 419-422.
43. H.T. Chen*, C.Q. Wang, and M.Y. Li, Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling, Microelectronics Reliability, 46 (2006) 1348–1356.
44. H.T. Chen*, C.Q. Wang, M.Y. Li, and D.W. Tian, Effect of thermal aging on the microstructure evolution and solder joint reliability in hard disk drive under mechanical shock, IEEE Transactions on Component and Packaging Technology, Vol.31 Issue.4 (2008) 831-836.
45. H.T. Chen*, C.Q. Wang, M.Y. Li, and D.W. Tian, Influence of thermal cycling on the microstructure and shear strength of Sn3.5Ag0.75Cu and Sn63Pb37 solder joints on Au/Ni metallization, Journal of Materials Science and Technology, Vol.23 No. 1 (2007) 68-72.
会议论文及发表演说
1. H.T. Chen, C.Q. Wang, M.Y. Li, Y.B. Wang, D.Q. Huang, Mechanical shock modeling and testing of lead-free solder joint in hard disk drive head assembly, Proceedings of Asian Green Electronics Conference, 2005, Shanghai.
2. H.T. Chen, C.Q. Wang, C. Yan, Y. Huang, and H.Y. Liu, Investigation on interfacial reactions on AuNiCu and Ni (Cu) metallizations in SnPb, SnAg and SnAgCu solder joints, IMAPS, 2006, Taiwan.
3. H.T. Chen, C.Q. Wang, Cheng.Y, M.Y. Li, and Y. Huang, Effects of solder volume on redeposition of (Au,Ni)Sn4 intermetallics in SnAgCu solder joints, ICEPT, 2006, Shanghai.
4. H.T. Chen, C.Q. Wang, M.Y. Li, Cheng.Y, and Y. Huang, Coupling effect between two pads in Ni(Au/Ni/Cu)-SnAg-Cu sandwich solder joints during reflow and thermal aging, ICEPT, 2006, Shanghai.
5. H.T. Chen, C.Q. Wang, M.Y. Li, Experimental and FEM Studies of J-lead Solder Joint Reliability. International Conference on the Business of Electronic Product Reliability and Liability, 2004, Shanghai.
6. H.T. Chen, C.Q. Wang, The Numerical Analysis of the Effects of the Gravity on Solder Joint Formation in SMT, The 4th International Conference on Physical and Numerical Simulation of Materials Processing, 2004, Shanghai.
7. H.T. Chen, T. Mattila, J. Li, X. W. Liu, M. Y. Li, J. K. Kivilahti，Localized Recrystallization and Cracking Behavior of Lead-free Solder Interconnections under Thermal Cycling, International conference on Electronic Packaging Technology & High Density Packaging，2009, Beijing. 562-568.
8. T. T. Mattila, H. Chen, and J. K. Kivilahti, The Reliability of Solder Interconnections under Cyclic Thermal and Mechanical Shock Loading, Proceedings of IMAPS Nordic, 2008, Helsingoer, Denmark.
9. D.W. Tian, H.T. Chen, C.Q. Wang, Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint, ICEPT,2005, Shenzhen.
10. D.W. Tian, C.Q. Wang, Y.H. Tian, and H.T. Chen, Prediction of Micro Pitch Motion of a Micro
